The first commercial provider of quantum sensing technology
3D Defect Imaging.
Unmatched depth reach.
Nano-scale resolution.
Our innovation
We have created diamond-based quantum sensors at the atomic scale, capable of operating in extreme conditions.
Our quantum sensing technology utilizes solid-state qubits integrated into diamonds. Quantum sensing transcends physical limitations in terms of spatial resolution and sensitivity, surpassing the capabilities of classical sensors.



Technical Specs
Our current measurement limits
Magnetic Current Imaging
- 3D imaging capability
- Imaging of metallisation down to 200 nm feature sizes for advanced back-end-of-line (e.g. hybrid bonding, advanced package)
- Depth reach up to 500 µm and a depth resolution up to 1 µm
Widefield Technique
- Widefield imaging. No raster scan required for areas up to 4 mm x 4 mm Field of View
- Stitching of widefield images available for samples of cm-size
Room Temperature Operation
- Robust imaging and testing at room temperature
- Stable down to cryogenic temperatures and up to 700 C°
Our Contribution
We build next-gen testing tools based on quantum sensing that detect issues early, reduce waste, and improve yield

Our tools help fabs to:
1. Detect defects early preventing rework and scrap.
2. Reduce material loss through fewer lost wafers and excursions.
3. Have direct impact on Scope 3: less CO₂, fewer inputs, more output.
