Product Overview

The QDm.1: find electrical faults without destroying the chip.

A quantum diamond microscope that images the current inside a device, locates opens and shorts non-destructively, and gives you depth on every defect — in minutes. Available today.

Specifications
Lateral Resolution (xy)
Down to 1.4 μm (standoff-dependent)
Depth Resolution (z)
Down to 0.5 μm (~10% distance to sensor)
Field of View
Up to 3 mm x 3 mm, automatic stitching up to 5 cm x 5 cm
Noise Floor
235 nT (DC)
Defect Types
Package and die: shorts (wide range), leakages, opens
Detection Capability
Open & Short Circuits
Sensitivity
<7 μT/√Hz (Class A diamond)
Typical Measurement Time
3-5 minutes (for >10 mA currents)
Requirements
Voltage / Power
230 V (single phase) / 16 A
Mechanical Stability
Optical table with suspension, stabilised sample region
Operating Temperature
15 - 40 °C
Environment
Ambient conditions (Room temperature and pressure)
Installed and operational

Already running in the labs that matter

Our tool is installed and operational at our headquarters in Munich as well as leading FA labs, including EAG Laboratories in San Jose and Integrated Service Technology (iST) in Hsinchu, Taiwan.

QD Scope

Software built for failure-analysis engineers.

Our unique software interface puts advanced quantum sensing at your fingertips with an intuitive, powerful UX designed for semiconductor failure analysis and metrology teams.

Auto-Calibration and Intuitive Control

Intuitive measurements with seamless navigation, flexible controls, and smart self-calibration for users of all levels.

Interactive Data and Annotations

Access all data components simultaneously or individually. Draw, annotate, mark data freely and export in various data formats.

Overlay Visualization

Overlay your analysis data on different adjacent data such as optical and Infrared images, as well as hotspot data.

Large Area Stitching

5 cm x 5 cm travel range to stitch larger images without sample replacement.

Current Density Reconstruction

Convert your magnetic field data into electrical activity with Machine Learning enhanced 3D interactive visualization and cross-section views for deeper, actionable insights.

Product and Services

Ready for today. Ready for tomorrow.

In-Lab

Commercially available, reach out for more information
‍‍
High-resolution, non-destructive localization of defects at the single-chip level for R&D and failure analysis.

In-Line

Under development, reach out for early access
‍
High-throughput wafer mapping for real-time yield monitoring and optimization of production processes.‍

Find your use-case

Your sample. Your workflow. Experience QDm.1 first-hand

Purchase the QDm.1, a powerful tool for imaging electrical activity in circuits and non-destructively isolating short and open failures. Or join our exclusive demo program today to see the system in action at your facility.

Testing Level
Use Case Level

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