Our testing solutions
reveal what others can't.
See deeper.
3D insight into chip defects at nano-scale resolution.
3D insight into chip defects at nano-scale resolution.
See faster.
Wide field quantum imaging that captures large chip areas in seconds.
Wide field quantum imaging that captures large chip areas in seconds.
See without damage.
Non-destructive imaging through advanced packaging and buried layers.
Non-destructive imaging through advanced packaging and buried layers.
Our Mission
Develop the next-generation quantum sensing metrology platform to push the boundaries of chipmaking.
investment plan
QD plans €152 million investment in next-gen quantum-based chip testing facility in Munich, Germany
News about QuantumDiamonds
Newsroom
Company Updates
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Apr 21, 2026
QD deploys failure analysis technology at leading Taiwan semiconductor test house
Company Updates
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Apr 21, 2026
QD deploys failure analysis technology at leading Taiwan semiconductor test house
Company Updates
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Apr 21, 2026
QD deploys failure analysis technology at leading Taiwan semiconductor test house
Company Updates
Company Updates
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Apr 8, 2026
QD installs first QDm.1 in the US at Eurofins EAG Laboratories
Company Updates
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Apr 8, 2026
QD installs first QDm.1 in the US at Eurofins EAG Laboratories
Company Updates
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Apr 8, 2026
QD installs first QDm.1 in the US at Eurofins EAG Laboratories
Company Updates
Company Updates
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Mar 11, 2026
QD wins German Physical Society award for outstanding achievements in translating state-of-the-art physics into industrial applications
Company Updates
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Mar 11, 2026
QD wins German Physical Society award for outstanding achievements in translating state-of-the-art physics into industrial applications
Company Updates
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Mar 11, 2026
QD wins German Physical Society award for outstanding achievements in translating state-of-the-art physics into industrial applications
Company Updates
Our Products and services
Take semiconductor testing to the next level
QuantumDiamonds develops and deploys next-gen semiconductor testing tools for the advanced packaging era, while offering in-house failure analysis with quantum sensing as a service.
In-Lab
Commercially available, reach out for more information
High-resolution, non-destructive localization of defects at the single-chip level for R&D and failure analysis.
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In-Line
Under development, reach out for early access
High-throughput wafer mapping for real-time yield monitoring and optimization of production processes.
Technical Specs
Unprecedented depth reach, resolution and speed for testing advanced semiconductors.
Our technology metrics:
Magnetic Current Imaging
- Detects shorts, leakages and opens
- Sees details up to 100× smaller than traditional inspection, with 100–1,000× lower noise and 3-10× higher sensitivity
Widefield Technique
- Up to 3 × 3 mm field of view
- Stitching up to 5 × 5 cm
- Results in minutes, not hours
- Ideal for large-area defect mapping
Operational Conditions
- Robust imaging and testing at room temperature
- Stable down to cryogenic temperatures and up to 700 °C
Our projects
Our engagements in the quantum race
Read about our partner projects:
Facts & Figures
QD in numbers
2022
Founded
3
Continents served
60+
Employees
