QD and TU Munich Intensify Strategic Collaboration on Quantum Sensing for Semiconductor Innovation

Munich, February 13th, 2026 – QuantumDiamonds GmbH, the global leader in quantum sensing, is deepening its collaboration with Professor Dr. Hussam Amrouch, Chair of AI Processor Design at the Technical University of Munich (TUM) and the Founding Director of the Munich Advanced-Technology Center for High-Tech AI Chips (MACHT-AI). The partnership aims to explore new frontiers in semiconductor diagnostics, with a particular focus on AI chips and advanced failure analysis techniques.

As chip designs become more compact, complex, and vertically integrated, traditional tools face growing limitations in resolution, speed, and non-invasiveness. QuantumDiamonds’ quantum diamond microscope (QDM) offers high-resolution, widefield magnetic field imaging based on nitrogen-vacancy centers in diamond, enabling nanoscale current mapping within multi-layered and heterogeneously integrated chips.

Professor Amrouch brings deep expertise in semiconductor reliability, advanced packaging, ultra-efficient AI processors, and in advanced CMOS technologies, making him an ideal partner in adapting QDM to future-proof diagnostic workflows for next-generation computing systems.

“Collaborations like this are exactly what we need to push boundaries,” said Kevin Berghoff, CEO and Co-Founder of QuantumDiamonds. “When cutting-edge chip design meets disruptive metrology, new opportunities emerge. Not only technologically, but across the semiconductor value chain.”

The partnership supports shared goals in design-for-diagnosis, verification of AI accelerators, and scalable, non-destructive testing, crucial for improving yield, time-to-market, and trust in advanced semiconductor systems.

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