QD in the Press

A breakthrough in non-destructive chip analysis: QuantumDiamonds showcases how quantum magnetic imaging reveals buried failures inside advanced 2.5D/3D packages—setting a new benchmark for next-generation semiconductor diagnostics.

QuantumDiamonds introduced the QDm.1 at SEMICON Taiwan 2025, the first quantum sensing platform that non-destructively localizes open and short failures in advanced semiconductors with micron-level accuracy. Built on diamond-based quantum sensing, it enhances failure analysis success across advanced packaging, 2.5D/3D ICs, chiplets, and wide bandgap devices, with first shipments scheduled for Q1 2026.

German Handelsblatt featured QuantumDiamonds in their "Startup Check" after an onsite visit, highlighting its potential as a game-changer in semiconductor testing.