QuantumDiamonds releases QD m.1 at Semicon Taiwan: Localize and prevent elusive failures non-destructively, boost analysis success

Taipei, Taiwan - September 12, 2025 – At Semicon Taiwan 2025, QuantumDiamonds announced the release of the QD m.1, world's first dedicated quantum sensing failure analysis platform for open failure detection in advanced semiconductors. Bound for shipment in Q1 2026, the QD m.1 is capable of localizing open and short failures with micron-level accuracy in advanced packaging and wide band-gap power devices.

Detection of open failures has been one of the main pain points for chip manufacturers for decades. Designed to tackle this notorious challenge, the QD m.1 delivers an intuitive and non-destructive localization technique for intermittent and true open failures down to micron-level accuracy. By extending failure analysis capabilities to the elusive case of opens, the quantum sensing system equips failure analysis engineers with a reliable method to accelerate analysis in advanced devices.

“With QD m.1, we provide a powerful new approach to customers for localizing soft and hard open failures. Our quantum sensing platform delivers large field-of-view imaging that can pinpoint opens with a micron-level accuracy.” said Fleming Bruckmaier, Co-Founder and CTO, QuantumDiamonds. “Being able to localize opens as intuitive spots on an image, the QD m.1 is a very valuable addition to techniques such as EOTPR and EBAC for our customers.”

Beyond opens, the QD m.1 is also a strong addition to the failure analysis toolkit for shorts and leakage. By non-destructively imaging buried metal paths at both package and die level, the platform reveals detailed current flow behavior around hotspots. This enables layout-matching, which automatically allows designers and manufacturers to know which layer a defect is in. This is useful for streamlining sample preparation and increases the success rate for root cause analysis.

Using quantum defects in patented diamond sensors, QuantumDiamonds' platform provides a powerful diagnostic tool for complex and emerging technologies such as advanced packaging, 2.5D/3D ICs, chiplets, and wide bandgap materials. With its powerful combination of sensitivity, resolution, and usability, the QD m.1 establishes a new standard for magnetic imaging in semiconductor analysis.

“We designed the QD m.1 to address the diagnostic challenges of advanced semiconductor devices. Built on world-leading quantum sensing technology, it enables high-resolution, high-sensitivity magnetic imaging in minutes for a wide variety of failure analysis use-cases.”, said Kevin Berghoff, CEO and Co-Founder of QuantumDiamonds.

First deliveries to customers in Taiwan, and US are scheduled for Q1 2026.