Localize semiconductor defects including depth with high accuracy, non-destructively
Already running in the labs that matter
Our tool is installed and operational at our headquarters in Munich as well as leading FA labs, including EAG Laboratories in San Jose and Integrated Service Technology (iST) in Hsinchu, Taiwan.
Failures don't stand a chance
Our application notes come from anonymized, real customer measurements. Start with this case study of our non-destructive failure analysis of an integrated fan-out package-on-package chip.
Quantum Diamond Microscopy for Non-Destructive Failure Analysis of an Integrated Fan-Out Package-on-Package Chip
Newsroom
QuantumDiamonds Reaches Key Milestone on the Path to Inline Electrical Inspection with Contact-Free Current Imaging
QuantumDiamonds Reaches Key Milestone on the Path to Inline Electrical Inspection with Contact-Free Current Imaging
QuantumDiamonds Reaches Key Milestone on the Path to Inline Electrical Inspection with Contact-Free Current Imaging
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Bavarian Deputy Minister-President and German Federal Ministry for Economic Affairs (BMWE) visit as QuantumDiamonds opens first section of its new Munich production facility
Bavarian Deputy Minister-President and German Federal Ministry for Economic Affairs (BMWE) visit as QuantumDiamonds opens first section of its new Munich production facility
Bavarian Deputy Minister-President and German Federal Ministry for Economic Affairs (BMWE) visit as QuantumDiamonds opens first section of its new Munich production facility
QuantumDiamonds and TU Munich receive funding for TroDeQu, the first European effort to detect hardware trojans with quantum sensing
QuantumDiamonds and TU Munich receive funding for TroDeQu, the first European effort to detect hardware trojans with quantum sensing
QuantumDiamonds and TU Munich receive funding for TroDeQu, the first European effort to detect hardware trojans with quantum sensing
Ready for today. Ready for tomorrow.
QuantumDiamonds develops and deploys next-gen semiconductor testing tools for the advanced packaging era, while offering in-house failure analysis with quantum sensing as a service.
In-Lab
Commercially available, reach out for more information
High-resolution, non-destructive localization of defects at the single-chip level for R&D and failure analysis.
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In-Line
Under development, reach out for early access
High-throughput wafer mapping for real-time yield monitoring and optimization of production processes.
Unprecedented depth reach, resolution and speed for testing advanced semiconductors.
Our technology metrics:
Magnetic Current Imaging
- Detects shorts, leakages and opens
- Sees details up to 100× smaller than traditional inspection, with 100–1,000× lower noise and 3-10× higher sensitivity
Widefield Technique
- Up to 3 × 3 mm field of view
- Stitching up to 5 × 5 cm
- Results in minutes, not hours
- Ideal for large-area defect mapping
Operational Conditions
- Robust imaging and testing at room temperature
- Stable down to cryogenic temperatures and up to 700 °C
Our engagements in the quantum race
Read about our partner projects:
